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#advanced packaging

2 discoveries tagged “advanced packaging”.

Intel EMIB-T Breaks Past Existing AI & HPC Scaling Limits, Enabling Ultra-Large Die Complexes With Over 10x Reticle Dies & 12 Gb/s+ HBM4e DRAM

Wccftech
Intel's EMIB-T technology is a breakthrough in advanced packaging, enabling the creation of ultra-large die complexes that surpass current AI and HPC scaling limits. · This…
Insights: Intel's EMIB-T is notable for its potential to revolutionize the semiconductor industry by overcoming current packaging constraints, making it a key player in the future of AI and…
advanced packagingsemiconductorsAI

AMD's EPYC Venice To Outpace NVIDIA's Vera CPUs With 6.75M Units by 2027, Morgan Stanley Says, as Zen 6 Eclipses a 5.75M Rival

Wccftech
AMD's EPYC Venice CPUs are projected to surpass NVIDIA's Vera CPUs in unit sales by 2027, with an expected 6.75 million units sold, according to Morgan Stanley. · Despite AMD's…
Insights: The rivalry between AMD and NVIDIA in the CPU market is significant as it drives innovation and competition, benefiting consumers with more advanced and efficient products. · This…
CPUsAIadvanced packaging