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#packaging

2 discoveries tagged “packaging”.

India’s OSAT-ATMP Build-Out: From Legacy Packages to 2.5D - EE Times

EE Times
Advanced System in Package (ASIP) Technologies is building an OSAT facility in Visakhapatnam, India, in partnership with Korean company APACT, aiming for production in 18 months.…
Insights: This development is significant as it marks India's growing presence in the global semiconductor manufacturing landscape, offering opportunities for local and international…
semiconductorspackagingIndia

TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say - EE Times

EE Times
TSMC is facing challenges with its CoWoS advanced packaging technology, which is crucial for integrating AI accelerators with high-bandwidth memory (HBM). This has led to…
Insights: This development is notable as it highlights the competitive dynamics in the semiconductor industry, where packaging technology can significantly impact market share and customer…
semiconductorspackagingAI